- All sections
- C - Chemistry; metallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatings; electroforming; joining workpieces by electrolysis; apparatus therefor
- C25D 3/38 - Electroplating; Baths therefor from solutions of copper
Patent holdings for IPC class C25D 3/38
Total number of patents in this class: 1188
10-year publication summary
|
90
|
129
|
116
|
121
|
128
|
110
|
106
|
104
|
128
|
33
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Rohm and Haas Electronic Materials LLC | 637 |
62 |
| Atotech Deutschland GmbH | 586 |
59 |
| JX Nippon Mining & Metals Corporation | 1576 |
46 |
| BASF SE | 19740 |
43 |
| Lam Research Corporation | 4775 |
42 |
| MacDermid Enthone Inc. | 237 |
35 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
22 |
| Novellus Systems, Inc. | 559 |
22 |
| Chang Chun Petrochemical Co., Ltd. | 112 |
20 |
| SK Nexilis Co., Ltd. | 42 |
20 |
| Applied Materials, Inc. | 16587 |
18 |
| Dow Global Technologies LLC | 10147 |
17 |
| Lotte Energy Materials Corporation | 35 |
16 |
| Alchimer | 52 |
14 |
| Circuit Foil Luxembourg | 27 |
14 |
| Suzhou Shinhao Materials LLC | 14 |
14 |
| Toyota Motor Corporation | 28582 |
11 |
| The Furukawa Electric Co., Ltd. | 3486 |
11 |
| C. Uyemura & Co., Ltd. | 156 |
11 |
| ILJIN Materials Co., Ltd. | 39 |
10 |
| Other owners | 681 |